ISSCC 2024: Samsung Doubles DDR5 Capacity With Symmetric-Mosaic Architecture
In our final ISSCC spotlight, we explore Samsung's paper on a high-capacity, high-speed DDR5 memory that implements a monolithic-die-based 32-Gb DDR5.
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In our final ISSCC spotlight, we explore Samsung's paper on a high-capacity, high-speed DDR5 memory that implements a monolithic-die-based 32-Gb DDR5.
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The team from Korea Advanced Institute of Science and Technology (KAIST), Korea Advanced Nano Fab Center (KANC), and Chungbuk National University, sees its work as being pioneering, adding
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Infineon has released XHP 3 IGBT modules to simplify parallelization in complex designs without sacrificing efficiency.
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