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Novosense Debuts 3D Dual-Output Hall Latches for Auto Motor Control
  • Hotenda
  • 2025-08-23

Novosense Debuts 3D Dual-Output Hall Latches for Auto Motor Control

The new series of dual-output Hall latches allows system designers to measure both speed and direction using a single integrated chip.

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Micron Unveils PCIe Gen6 SSDs to Power the Next Wave of AI Data Centers
  • Hotenda
  • 2025-08-18

Micron Unveils PCIe Gen6 SSDs to Power the Next Wave of AI Data Centers

Micron’s new SSD portfolio delivers faster speeds, more capacity, and better energy efficiency for AI workloads.

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Arteris Expands Multi-Die Network-on-Chip Design IP and Software
  • Hotenda
  • 2025-07-02

Arteris Expands Multi-Die Network-on-Chip Design IP and Software

The upgraded multi-die IP solution may speed the SoC design process in an AI-driven market that demands greater chip performance.

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Renesas Releases Two New IO-Link Enhancing Devices
  • Hotenda
  • 2024-11-21

Renesas Releases Two New IO-Link Enhancing Devices

Renesas has developed two new semiconductor solutions for the growing IO-Link market. The new IO-Link solutions include a four-channel master IC and a dual-channel sensor signal conditioner IC.

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Unraveling the Design Equations of the Class E Power Amplifier
  • Hotenda
  • 2024-11-10

Unraveling the Design Equations of the Class E Power Amplifier

In this article, we analyze the operation of the Class E amplifier and examine the underlying assumptions of its design equations

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Hot Chips Keynote: AMD President Shares Thoughts on AI Pervasiveness
  • Hotenda
  • 2024-09-02

Hot Chips Keynote: AMD President Shares Thoughts on AI Pervasiveness

AMD is diversifying its portfolio to target the AI needs of every segment: cloud, embedded, and endpoint.

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