Arteris Expands Multi-Die Network-on-Chip Design IP and Software
The upgraded multi-die IP solution may speed the SoC design process in an AI-driven market that demands greater chip performance.
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The upgraded multi-die IP solution may speed the SoC design process in an AI-driven market that demands greater chip performance.
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Announced today, the company's newest SoC increases small-device edge computing performance while reducing cost and power consumption to deliver a 10-year operating life with a coin cell.
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The new MCU combines an Arm Cortex M4F core with advanced motor control, broad wireless protocol compatibility, and touch interface capability.
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The MOTIX TLE994x/5x series integrates MCU, driver, and power stage for compact automotive motor control.
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