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STGB30V60DF

STGB30V60DF

STGB30V60DF

STMicroelectronics

STGB30V60DF datasheet pdf and Transistors - IGBTs - Single product details from STMicroelectronics stock available on our website

SOT-23

STGB30V60DF Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 20 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Weight 2.240009g
Transistor Element Material SILICON
Operating Temperature-55°C~175°C TJ
PackagingCut Tape (CT)
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Subcategory Insulated Gate BIP Transistors
Max Power Dissipation258W
Terminal FormGULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number STGB30
JESD-30 Code R-PSSO-G2
Number of Elements 1
Element ConfigurationSingle
Case Connection COLLECTOR
Input Type Standard
Power - Max 258W
Transistor Application POWER CONTROL
Polarity/Channel Type N-CHANNEL
Collector Emitter Voltage (VCEO) 600V
Max Collector Current 60A
Reverse Recovery Time 53 ns
Collector Emitter Breakdown Voltage600V
Collector Emitter Saturation Voltage1.85V
Max Breakdown Voltage 600V
Turn On Time59 ns
Test Condition 400V, 30A, 10 Ω, 15V
Vce(on) (Max) @ Vge, Ic 2.3V @ 15V, 30A
Turn Off Time-Nom (toff) 225 ns
IGBT Type Trench Field Stop
Gate Charge163nC
Current - Collector Pulsed (Icm) 120A
Td (on/off) @ 25°C 45ns/189ns
Switching Energy 383μJ (on), 233μJ (off)
Gate-Emitter Voltage-Max 20V
RoHS StatusROHS3 Compliant
In-Stock:2401 items

Pricing & Ordering

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STGB30V60DF Product Details

STGB30V60DF Description


The STGB30V60DF device is an IGBT developed using an advanced proprietary trench gate field stop structure. The device is part of the V series of IGBTs, which represent an optimum compromise between conduction and switching losses to maximize the efficiency of very high frequency converters. Furthermore, a positive VCE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation.



STGB30V60DF Features


  • Maximum junction temperature: TJ = 175 °C

  • Tail-less switching off

  • VCE(sat) = 1.85 V (typ.) @ IC = 30 A

  • Tight parameters distribution

  • Safe paralleling

  • Low thermal resistance

  • Very fast soft recovery antiparallel diode



STGB30V60DF Applications


  • Photovoltaic inverters

  • Uninterruptible power supply

  • Welding

  • Power factor correction

  • Very high frequency converters


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