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RJP6085DPK-00#T0

RJP6085DPK-00#T0

RJP6085DPK-00#T0

Renesas Electronics America

IGBT 600V 40A 178.5W TO-3P

SOT-23

RJP6085DPK-00#T0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case TO-3P-3, SC-65-3
Operating Temperature150°C TJ
PackagingTube
Published 2009
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Subcategory Insulated Gate BIP Transistors
Max Power Dissipation178.5W
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count4
Input Type Standard
Turn On Delay Time30 ns
Power - Max 178.5W
Polarity/Channel Type N-CHANNEL
Turn-Off Delay Time 60 ns
Collector Emitter Voltage (VCEO) 3.5V
Max Collector Current 40A
Collector Emitter Breakdown Voltage600V
Vce(on) (Max) @ Vge, Ic 3.5V @ 15V, 40A
Gate-Emitter Voltage-Max 30V
Gate-Emitter Thr Voltage-Max 6V
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:2049 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$4.33000$4.33
10$3.86300$38.63
25$3.47680$86.92

About RJP6085DPK-00#T0

The RJP6085DPK-00#T0 from Renesas Electronics America is a high-performance microcontroller designed for a wide range of embedded applications. This component features IGBT 600V 40A 178.5W TO-3P.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RJP6085DPK-00#T0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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