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BSR57,215

BSR57,215

BSR57,215

NXP USA Inc.

BSR57,215 datasheet pdf and Transistors - JFETs product details from NXP USA Inc. stock available on our website

SOT-23

BSR57,215 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Surface MountYES
Transistor Element Material SILICON
Operating Temperature150°C TJ
PackagingTape & Reel (TR)
Published 1997
JESD-609 Code e3
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
ECCN Code EAR99
Terminal Finish Tin (Sn)
HTS Code8541.21.00.95
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number BSR57
Pin Count3
JESD-30 Code R-PDSO-G3
Qualification StatusNot Qualified
Number of Elements 1
Configuration SINGLE
Operating ModeDEPLETION MODE
Power - Max 250mW
FET Type N-Channel
Transistor Application SWITCHING
Drain Current-Max (Abs) (ID) 0.01A
Drain-source On Resistance-Max 40Ohm
DS Breakdown Voltage-Min 40V
FET Technology JUNCTION
Power Dissipation-Max (Abs) 0.225W
Feedback Cap-Max (Crss) 5 pF
Current - Drain (Idss) @ Vds (Vgs=0) 20mA @ 15V
Voltage - Cutoff (VGS off) @ Id 5V @ 0.5nA
Voltage - Breakdown (V(BR)GSS) 40V
Resistance - RDS(On) 40Ohm
RoHS StatusROHS3 Compliant
In-Stock:4847 items

BSR57,215 Product Details

BSR57,215 Descritpion


The NXP BSR57,215 is a Symmetrical silicon N-channel depletion type junction field-effect transistor(FET) in a plastic microminiature envelope designed for application in thick and thin-film circuits.



BSR57,215 Features


  • Interchangeable drain and source connections

  • Small package



BSR57,215 Applications


  • Low-power, chopper or switching applications

  • Thick and thin-film circuits


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