VSC8662XIC-03 Overview
A 256-BGA package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.Mounting type Surface Mount is used.The telecom IC is composed of 1 circuits.Telecom switching configuration has 256 terminations.It operates at a voltage of 1.2V.A minimum temperature value -40°C is set to ensure normal operation.A maximum value of 100°C is set to ensure normal operation.Transceivers 2 are integrated into telecommunication tools.
VSC8662XIC-03 Features
Available in the 256-BGA package
2 transceivers
VSC8662XIC-03 Applications
There are a lot of Microchip Technology VSC8662XIC-03 Telecom applications.
- Remote wireless modules
- Frame Relay Switches and Access Devices (FRADS)
- Integrated Access Devices (IADs)
- E1 Rates PCM Line Interface
- NIU
- Integrated Multi-Service Access Platforms (IMAPs)
- CSU/DSU Equipment
- Fractional T1/E1/J1
- Digital cross connects (DSX-1)
- Switching Systems
