VSC8541XMV-01 Overview
The 68-VFQFN Exposed Pad package reduces the amount of space on a board.Telecommunications equipment is packed using the Tray method.A Surface Mount mounting type is used.An 1-circuit makes up this telecom IC .Operating temperatures of -40°C~125°C can ensure reliable performance.
VSC8541XMV-01 Features
Available in the 68-VFQFN Exposed Pad package
VSC8541XMV-01 Applications
There are a lot of Microchip Technology VSC8541XMV-01 Telecom applications.
- Home Side Box
- T1/E1/J1 Performance Monitoring
- Integrated Multi-Service Access Platforms (IMAPs)
- Network Multiplexing and Terminating Equipment
- Channel Banks
- Digital Cross-Connect Systems
- SONET/SDH terminal
- E2 Rates PCM Line Interface
- E3/DS3 Access Equipment
- DECT (Digital European Cordless Telephone) Base
