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PEB 3324 HL V1.4

PEB 3324 HL V1.4

PEB 3324 HL V1.4

Infineon Technologies

PEB3324 Telecom device4 Circuits

SOT-23

PEB 3324 HL V1.4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 176-LQFP
Supplier Device Package PG-LQFP-176
Operating Temperature-40°C~85°C
PackagingTray
Series VINETIC®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Power (Watts) 400mW
Base Part Number PEB3324
Function Analog Voice Access
Interface ADPCM
Number of Circuits 4
In-Stock:1802 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$59.869476$59.869476
10$56.480638$564.80638
100$53.283621$5328.3621
500$50.267567$25133.7835
1000$47.422232$47422.232

PEB 3324 HL V1.4 Product Details

PEB 3324 HL V1.4 Overview


To save board space, the 176-LQFP package is used.The way of Tray is employed for telecommunications equipment packing.A Surface Mount mounting type is used.An 4-circuit makes up this telecom IC .A -40°C~85°C-temperature setting offers reliable performance.Telecom switching's base part number of PEB3324 can be a method to find more related parts.There are many similarities between it and the electronic parts of the VINETIC? series.

PEB 3324 HL V1.4 Features


Available in the 176-LQFP package

PEB 3324 HL V1.4 Applications


There are a lot of Infineon Technologies PEB 3324 HL V1.4 Telecom applications.

  • Digital loop carrier (DLC)
  • DECT (Digital European Cordless Telephone) Base Stations
  • PDH Multiplexers
  • Private branch exchange (PBX)
  • E1 LAN/WAN Routers
  • Codec function on telephone switch line cards
  • Home Side Box
  • PBX (Private Branch Exchange)
  • Digital Modems
  • Channel Service Units (CSUs): T1/E1/J1

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