VSC7421XJQ-02 Overview
TQFP package is used to save board space.The way of Tray is employed for telecommunications equipment packing.The mounting type is Surface Mount.This telecom IC is composed of 1 circuits.1V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.The SparX?-III-17um series is capable of providing a number of similar functions to the W series.Normal operation is ensured by setting 0°C to a minimum value.It is necessary to set the temperature at the maximum value of 125°C for the telecom IC to function normally.
VSC7421XJQ-02 Features
Available in the TQFP package
VSC7421XJQ-02 Applications
There are a lot of Microchip Technology VSC7421XJQ-02 Telecom applications.
- ISDN terminal adapter
- T1 Digital Cross Connects (DSX-1)
- Short/Medium Loop
- PCM Test Equipment
- CSU/DSU E1/T1/J1 Interface
- Interfaces to E3
- Fiber in the loop (FITL)
- T1/E1/J1 Performance Monitoring
- High speed data transmission line cards
- Integrated Multi-Service Access Platforms (IMAPs)
