IRLL3303PBF Description
International Rectifier's Fifth Generation HEXFETs use cutting-edge processing methods to provide exceptionally low on-resistance per silicon area. This feature offers the designer a highly effective and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.
The SOT-223 package is made to be surface-mounted utilizing infrared, vapor phase, or wave soldering processes.
In addition to having the same simple automatic pick-and-place functionality as regular SOT or SOIC packages, this package's special design offers increased thermal performance thanks to a larger tab for heatsinking. One Watt of power can be lost in a typical surface mount application.
IRLL3303PBF Features
IRLL3303PBF Applications
Power Management
Consumer Electronics
Portable Devices
Industrial
