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EPC8009

EPC8009

EPC8009

EPC

GANFET TRANS 65V 2.7A BUMPED DIE

SOT-23

EPC8009 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die
Operating Temperature-40°C~150°C TJ
PackagingTape & Reel (TR)
Published 2012
Series eGaN®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature150°C
Min Operating Temperature -40°C
Technology GaNFET (Gallium Nitride)
FET Type N-Channel
Rds On (Max) @ Id, Vgs 130mOhm @ 500mA, 5V
Vgs(th) (Max) @ Id 2.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 52pF @ 32.5V
Current - Continuous Drain (Id) @ 25°C 2.7A Ta
Gate Charge (Qg) (Max) @ Vgs 0.45nC @ 5V
Drain to Source Voltage (Vdss) 65V
Drive Voltage (Max Rds On,Min Rds On) 5V
Vgs (Max) +6V, -4V
Continuous Drain Current (ID) 2.7A
Input Capacitance52pF
Rds On Max 130 mΩ
RoHS StatusROHS3 Compliant
In-Stock:2010 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$867.445200$867.4452
10$818.344528$8183.44528
100$772.023140$77202.314
500$728.323717$364161.8585
1000$687.097846$687097.846

About EPC8009

The EPC8009 from EPC is a high-performance microcontroller designed for a wide range of embedded applications. This component features GANFET TRANS 65V 2.7A BUMPED DIE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPC8009, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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