XCVU33P-3FSVH2104E Overview
There is a 2104-BBGA, FCBGA package that includes this component. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. 208 I/Os are available for transferring data more efficiently. Logic blocks consist of 961800 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates at a voltage of 0.873V~0.927V and uses a battery to supply power. It is a type of FPGA belonging to the Virtex? UltraScale+? seies. When operating the machine, it is important to keep the temperature within 0°C~100°C TJ range. Having a RAM bit size of 24746394 means that this device will offer you a lot of memory. An array of 54960 LABs/CLBs is built into the FPGA.
XCVU33P-3FSVH2104E Features
208 I/Os
Up to 24746394 RAM bits
XCVU33P-3FSVH2104E Applications
There are a lot of Xilinx Inc. XCVU33P-3FSVH2104E FPGAs applications.
- Artificial intelligence (AI)
- Bioinformatics
- Industrial Ethernet
- Medical Applications
- Solar Energy
- Wireless Communications
- Camera time adjustments
- Space Applications
- Medical imaging
- Military Temperature
