XCVU13P-1FHGA2104E Overview
This package is included in the 2104-BBGA, FCBGA package and is available for purchase. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. 832 I/Os are available for transferring data more efficiently. The basic building blocks of logic contain 3780000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. The FPGA belongs to the Virtex? UltraScale+? series of FPGAs, and it is one type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. There is an FPGA model contained in Tray in order to conserve space. Having a RAM bit size of 514867200 means that this device will offer you a lot of memory. This FPGA is built as an array of 216000 LABs/CLBs.
XCVU13P-1FHGA2104E Features
832 I/Os
Up to 514867200 RAM bits
XCVU13P-1FHGA2104E Applications
There are a lot of Xilinx Inc. XCVU13P-1FHGA2104E FPGAs applications.
- Industrial IoT
- Random logic
- ASIC prototyping
- Defense Applications
- Computer hardware emulation
- Military Temperature
- Voice recognition
- Aerospace and Defense
- Device controllers
- Ecosystem
