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XAZU2EG-1SBVA484Q

XAZU2EG-1SBVA484Q

XAZU2EG-1SBVA484Q

Xilinx Inc.

484 Terminations -40°C~125°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.85V

SOT-23

XAZU2EG-1SBVA484Q Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Package / Case 484-BFBGA, FCBGA
Surface MountYES
Operating Temperature-40°C~125°C TJ
PackagingTray
Series Zynq® UltraScale+™ MPSoC EG
Part StatusActive
Number of Terminations 484
HTS Code8542.31.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Terminal Pitch0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.2MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Length 19mm
Height Seated (Max) 2.61mm
Width 19mm
RoHS StatusROHS3 Compliant
In-Stock:59 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$626.07000$626.07
500$619.8093$309904.65
1000$613.5486$613548.6
1500$607.2879$910931.85
2000$601.0272$1202054.4
2500$594.7665$1486916.25

XAZU2EG-1SBVA484Q Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is used to build this SoC.Its package is 484-BFBGA, FCBGA.A 1.2MB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MPU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC EG series.For this SoC meaning, the average operating temperature should be -40°C~125°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 128.A 0.85V power supply should be used.Having 484 terminations in total makes system on a chip possible.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XAZU2EG-1SBVA484Q System On Chip (SoC) applications.


  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
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