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M2S010T-VFG256I

M2S010T-VFG256I

M2S010T-VFG256I

Microsemi Corporation

256 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V

SOT-23

M2S010T-VFG256I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Package / Case 256-LBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional FeatureLG-MIN, WD-MIN
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells12084
Flash Size 256KB
Length 14mm
Height Seated (Max) 1.56mm
Width 14mm
RoHS StatusRoHS Compliant
In-Stock:176 items

Pricing & Ordering

QuantityUnit PriceExt. Price
119$36.58504$4353.61976

M2S010T-VFG256I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 256-LBGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 10K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 138 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.In order to run it, it must be fed by at least 1.14V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 256 terminations in total.In order for this SoC chip to work properly, you can have 138 outputs.This system on chip SoC requires 1.2V power supply at all.The SoC chip is equipped with 138 inputs.In logic system on chips, there are 12084 logic cells.As for its flash size, it is 256KB.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S010T-VFG256I System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical

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