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M2S090T-FCSG325

M2S090T-FCSG325

M2S090T-FCSG325

Microsemi Corporation

325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 180 I/O 1.2V

SOT-23

M2S090T-FCSG325 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface MountYES
Operating Temperature0°C~85°C TJ
PackagingTray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional FeatureLG-MIN, WD-MIN
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B325
Number of Outputs 180
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells86316
Flash Size 512KB
Length 13.5mm
Height Seated (Max) 1.16mm
Width 11mm
RoHS StatusRoHS Compliant
In-Stock:79 items

Pricing & Ordering

QuantityUnit PriceExt. Price
176$119.96602$21114.01952

M2S090T-FCSG325 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A ARM® Cortex®-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion®2 series.The average operating temps for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 90K Logic Modules.Housed in the state-of-art Tray package.180 I/Os in total are included in this SoC part.It is advised to utilize a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.There are 325 terminations in total and that really benefits system on a chip.You can have 180 user outputs for this SoC chip.System on chip requires 1.2V power supplies.180 inputs are available on the SoC chip.Logic system on chips features 86316 logic cells.It has a 512KB flash.Additionally, this SoC processor features LG-MIN, WD-MIN.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S090T-FCSG325 System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors

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