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SIB452DK-T1-GE3

SIB452DK-T1-GE3

SIB452DK-T1-GE3

Vishay Siliconix

SIB452DK-T1-GE3 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Vishay Siliconix stock available on our website

SOT-23

SIB452DK-T1-GE3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Contact PlatingTin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case PowerPAK® SC-75-6L
Number of Pins 6
Weight 95.991485mg
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2014
Series TrenchFET®
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Resistance 2.4Ohm
Subcategory FET General Purpose Power
Technology MOSFET (Metal Oxide)
Terminal Position DUAL
Terminal FormC BEND
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Pin Count6
Number of Elements 1
Configuration SINGLE WITH BUILT-IN DIODE
Number of Channels 1
Power Dissipation-Max 2.4W Ta 13W Tc
Operating ModeENHANCEMENT MODE
Power Dissipation2.4W
Case Connection DRAIN
Turn On Delay Time12 ns
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 2.4 Ω @ 500mA, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 135pF @ 50V
Current - Continuous Drain (Id) @ 25°C 1.5A Tc
Gate Charge (Qg) (Max) @ Vgs 6.5nC @ 10V
Rise Time16ns
Drive Voltage (Max Rds On,Min Rds On) 1.8V 4.5V
Vgs (Max) ±16V
Fall Time (Typ) 15 ns
Turn-Off Delay Time 30 ns
Continuous Drain Current (ID) 1.5A
Threshold Voltage 1.5V
Gate to Source Voltage (Vgs) 16V
Drain to Source Breakdown Voltage 190V
Height 750μm
Length 1.6mm
Width 1.6mm
Radiation HardeningNo
REACH SVHC Unknown
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:9299 items

Pricing & Ordering

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SIB452DK-T1-GE3 Product Details

SIB452DK-T1-GE3 Description


The SIB452DK-T1-GE3 is an N-Channel 190 V (D-S) MOSFET. A form of field-effect transistor (FET) called a metal-oxide-semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET) is most frequently made by carefully controlling the oxidation of silicon. It has an isolated gate, whose voltage controls the device's conductivity. Electronic signals can be switched or amplified using this material's capacity to change conductivity in response to the amount of applied voltage. Nearly the same thing as a MOSFET is a metal-insulator-semiconductor field-effect transistor (MISFET). IGFET, or insulated-gate field-effect transistor, is another equivalent term.



SIB452DK-T1-GE3 Features


  • TrenchFET® power MOSFET

  • New thermally enhanced PowerPAK® SC-75 package

- Small footprint area

- Low on-resistance

  • High current: The same tendency as for low ON resistance.

  • High Speed: U-MOS is disadvantageous for high-speed switching because of large gate capacity (Ciss).

  • Withstand voltage: The optimum structure is selected for the target withstand voltage.

  • Low On-Resistance: U-MOS for products with 250 V or less, SJ-MOS (or DTMOS) are advantageous for products with more than that.



SIB452DK-T1-GE3 Applications


  • Boost converter for portable devices

  • Automotive

  • Industrial

  • Communications systems in particular

  • Automotive electronics

  • Switching devices in electronic control units

  • Power converters in modern electric vehicles


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