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TE0803-03-4AE11-A

TE0803-03-4AE11-A

TE0803-03-4AE11-A

Trenz Electronic GmbH

TE0803-03-4AE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0803-03-4AE11-A Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Operating Temperature0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU4CG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
In-Stock:3397 items

TE0803-03-4AE11-A Product Details

TE0803-03-4AE11-A Overview


Module or board type MPU Core describes the microcontroller.There are Zynq UltraScale+ XCZU4CG-1SFVC784E cores in its processor, which is what powers the microcontroller.It is default for the microcontroller to set the mode to 0°C~85°C.The size of the flash on the MCU electronics is 128MB.Connector type B2B refers to the type of connector.The MCUs is part of the TE0803 Series of products.As a precaution for ensuring that the software runs normally, the RAM size of the computer has been reduced to 2GB.

TE0803-03-4AE11-A Features


Core processor of Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash size of 128MB

TE0803-03-4AE11-A Applications


There are a lot of Trenz Electronic GmbH TE0803-03-4AE11-A Microcontroller, Microprocessor, FPGA Modules applications.

  • Embedded Instrumentation
  • Industrial Automation
  • Embedded Control Processing
  • Portable Data Terminals
  • Medical Instrumentation
  • Network Enabled Data Acquisition
  • Process Monitoring
  • Human Machine Interface
  • Human Machine Control Panel
  • Industrial Control

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