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TE0808-04-09EG-1EK

TE0808-04-09EG-1EK

TE0808-04-09EG-1EK

Trenz Electronic GmbH

MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E 2.05 x 2.99 52mmx76mm 0°C~85°C 128MB B2B TE0808 2GB

SOT-23

TE0808-04-09EG-1EK Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Operating Temperature0°C~85°C
Series TE0808
Size / Dimension 2.05 x 2.99 52mmx76mm
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU9EG-1FFVC900E
Module/Board Type MPU Core
Flash Size 128MB
RoHS StatusROHS3 Compliant
In-Stock:2764 items

TE0808-04-09EG-1EK Product Details

TE0808-04-09EG-1EK Overview


In this case, the module or board type of the microcontroller is MPU Core.With Zynq UltraScale+ XCZU9EG-1FFVC900E cores, the processor drives microprocessor chip.In order to use the microcontroller, the default setting is 0°C~85°C.The size of the flash on the MCU electronics is 128MB.The connector type B2B refers to the connector type.The TE0808 Series is the group in which MCU chip belongs.As a precaution for ensuring that the software runs normally, the RAM size of the computer has been reduced to 2GB.

TE0808-04-09EG-1EK Features


Core processor of Zynq UltraScale+ XCZU9EG-1FFVC900E
Flash size of 128MB


TE0808-04-09EG-1EK Applications


There are a lot of Trenz Electronic GmbH
TE0808-04-09EG-1EK Microcontroller, Microprocessor, FPGA Modules applications.


  • Data Acquisition
  • Industrial Control
  • Process Control
  • Process Monitoring
  • Healthcare Monitoring
  • Patient Monitoring
  • IoT Secure Gateways
  • Human Machine Interface
  • Human Machine Control Panel
  • Home and Building Automation

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