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TE0803-03-3AE11-A

TE0803-03-3AE11-A

TE0803-03-3AE11-A

Trenz Electronic GmbH

TE0803-03-3AE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0803-03-3AE11-A Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Operating Temperature0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU2CG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
In-Stock:4374 items

TE0803-03-3AE11-A Product Details

TE0803-03-3AE11-A Overview


A MPU Core-type board or module is used in this microcontroller.There are Zynq UltraScale+ XCZU2CG-1SFVC784E cores in its processor, which is what powers the microcontroller.0°C~85°C is the default setting for the microcontroller.Flash size on this MCU electronics is 128MB.Connector type B2B refers to the type of connector.I would say that MCU chip belongs to the TE0803 Series.As a precaution for ensuring that the software runs normally, the RAM size of the computer has been reduced to 2GB.

TE0803-03-3AE11-A Features


Core processor of Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash size of 128MB

TE0803-03-3AE11-A Applications


There are a lot of Trenz Electronic GmbH TE0803-03-3AE11-A Microcontroller, Microprocessor, FPGA Modules applications.

  • Process Monitoring
  • Healthcare Monitoring
  • Closed Loop Motor Control
  • Process Control
  • Home and Building Automation
  • Human Machine Interface
  • IoT Secure Gateways
  • Industrial Instrumentation
  • Embedded Instrumentation
  • Power Protection Systems

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