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TE0803-02-03EG-1EA

TE0803-02-03EG-1EA

TE0803-02-03EG-1EA

Trenz Electronic GmbH

MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E 2.05 x 2.99 52mmx76mm 0°C~85°C 128MB B2B TE0803 2GB

SOT-23

TE0803-02-03EG-1EA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Operating Temperature0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU3EG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
In-Stock:3481 items

TE0803-02-03EG-1EA Product Details

TE0803-02-03EG-1EA Overview


Module or board type MPU Core describes the microcontroller.There are Zynq UltraScale+ XCZU3EG-1SFVC784E cores in the processor.Microcontroller settings default to 0°C~85°C.There is a 128MB size to the MCU electronics's flash.An B2B connector has a B2B connector type.The MCUs is part of the TE0803 Series of products.This is 2GB in order to guarantee that the software runs normally.

TE0803-02-03EG-1EA Features


Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash size of 128MB


TE0803-02-03EG-1EA Applications


There are a lot of Trenz Electronic GmbH
TE0803-02-03EG-1EA Microcontroller, Microprocessor, FPGA Modules applications.


  • Embedded User Interfaces
  • Test and Measurement
  • Medical Devices
  • Data Acquisition
  • Industrial Control
  • Process Control
  • Process Monitoring
  • Healthcare Monitoring
  • Patient Monitoring
  • IoT Secure Gateways

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