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TE0808-04-15EG-1EK

TE0808-04-15EG-1EK

TE0808-04-15EG-1EK

Trenz Electronic GmbH

TE0808-04-15EG-1EK datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0808-04-15EG-1EK Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Operating Temperature0°C~85°C
Series TE0808
Size / Dimension 2.05 x 2.99 52mmx76mm
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type B2B
RAM Size 4GB
Core Processor Zynq UltraScale+ XCZU15EG-1FFVC900E
Module/Board Type MPU Core
Flash Size 128MB
RoHS StatusROHS3 Compliant
In-Stock:1035 items

TE0808-04-15EG-1EK Product Details

TE0808-04-15EG-1EK Overview


Module or board type MPU Core describes the microcontroller.Microprocessor chip is driven by a processor with Zynq UltraScale+ XCZU15EG-1FFVC900E cores.It is not surprising that 0°C~85°C is the microcontroller's default setting.There is a 128MB size to the MCU electronics's flash.B2B is the connector type.MCU chip belongs to the TE0808 Series.Software runs normally with RAM size 4GB when the RAM size is reduced.

TE0808-04-15EG-1EK Features


Core processor of Zynq UltraScale+ XCZU15EG-1FFVC900E
Flash size of 128MB

TE0808-04-15EG-1EK Applications


There are a lot of Trenz Electronic GmbH TE0808-04-15EG-1EK Microcontroller, Microprocessor, FPGA Modules applications.

  • Medical Devices
  • Human Machine Control Panel
  • Test and Measurement
  • Power Protection Systems
  • Industrial Gateways
  • Weighing Scales
  • Embedded Instrumentation
  • Embedded Control Processing
  • Home and Building Automation
  • Process Monitoring

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