DS26303LN-75+ Overview
In order to save space on the board, 144-LQFP Exposed Pad packages are used.Packing is done according to the Tray method.A Surface Mount-mount is used for mounting the telecom circuit.8 circuits are used in this telecom IC .3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.The supply current is 250mA.
DS26303LN-75+ Features
Available in the 144-LQFP Exposed Pad package
DS26303LN-75+ Applications
There are a lot of Rochester Electronics, LLC DS26303LN-75+ Telecom applications.
- T1/E1/J1 Performance Monitoring
- ISDN NT1/TA
- Central office
- M13 MUX
- T1/E1/J1 Multiplexer and Channel Banks
- Digital loop carrier (DLC)
- E1 Network Equipment
- Fractional T1/E1/J1
- Fiber to the Home (FTTH)
- Cable modem
