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VSC8584XKS-14

VSC8584XKS-14

VSC8584XKS-14

Microchip Technology

256 TerminationsTelecom device1 Circuits

SOT-23

VSC8584XKS-14 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 256-BGA
Surface MountYES
PackagingTray
Published 2016
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Voltage - Supply 1V
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 2.5V
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B256
Function Ethernet
Operating Temperature (Min) -40°C
Temperature GradeAUTOMOTIVE
Interface GMII, SerDes, SPI, TBI
Number of Circuits 1
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:122 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$80.61000$80.61
25$67.15640$1678.91
100$64.89000$6489

VSC8584XKS-14 Product Details

VSC8584XKS-14 Overview


Space is saved on the board by using the 256-BGA package.To pack telecommunications equipment, the way of Tray is used.Telecommunications equipment is mounted using Surface Mount.1 circuits are used in this telecom IC .Telecom circuit is possible to increase efficiency by providing 1V with a higher voltage.Configuration of this telecom circuit has 256 terminations.A 2.5V supply voltage is required to operate it.A minimum operating temperature of -40°C is supported.

VSC8584XKS-14 Features


Available in the 256-BGA package

VSC8584XKS-14 Applications


There are a lot of Microchip Technology VSC8584XKS-14 Telecom applications.

  • Integrated Access Devices (IADs)
  • Residential Gateways
  • Codec function on telephone switch line cards
  • T1/E1/J1 add/drop multiplexers (MUX)
  • PBX (Private Branch Exchange)
  • Interfaces to DS3
  • NIU
  • Cable PC
  • Digital Access Cross-connect System (DACs)
  • Network Multiplexing and Terminating Equipment

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