Welcome to Hotenda.com Online Store!

logo
userjoin
Home

VSC8564XKS-14

VSC8564XKS-14

VSC8564XKS-14

Microchip Technology

Telecom device

SOT-23

VSC8564XKS-14 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-PBGA (17x17)
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
RoHS StatusROHS3 Compliant
In-Stock:123 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$57.58000$57.58
25$47.96760$1199.19
100$46.35000$4635

VSC8564XKS-14 Product Details

VSC8564XKS-14 Overview


256-BGA package is used to save board space.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.

VSC8564XKS-14 Features


Available in the 256-BGA package

VSC8564XKS-14 Applications


There are a lot of Microchip Technology VSC8564XKS-14 Telecom applications.

  • DECT (Digital European Cordless Telephone) Base
  • Digital access cross connects
  • Interfaces to SONET STS-1 Networks
  • ISDN terminal adapter
  • Digital loop carrier (DLC)
  • Intelligent PBX
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Residential Gateways
  • Integrated Access Devices
  • T1/E1/J1 add/drop multiplexers (MUX)

Get Subscriber

Enter Your Email Address, Get the Latest News