VSC8564XKS-14 Overview
256-BGA package is used to save board space.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.
VSC8564XKS-14 Features
Available in the 256-BGA package
VSC8564XKS-14 Applications
There are a lot of Microchip Technology VSC8564XKS-14 Telecom applications.
- DECT (Digital European Cordless Telephone) Base
- Digital access cross connects
- Interfaces to SONET STS-1 Networks
- ISDN terminal adapter
- Digital loop carrier (DLC)
- Intelligent PBX
- High-Density T1/E1/J1 interfaces for Multiplexers
- Residential Gateways
- Integrated Access Devices
- T1/E1/J1 add/drop multiplexers (MUX)