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BT2LH-L0

BT2LH-L0

BT2LH-L0

Panduit Corp

BT2LH-L0 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website

SOT-23

BT2LH-L0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Package / Case Metal
Material Polyamide (PA66), Nylon 6/6
Weight 172.365101g
Body Material Nylon
Packaging50 per Pkg
Series DOME-TOP® BARB-TY® BT
Published 2005
Feature Weather Resistant
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature85°C
Min Operating Temperature -40°C
Color Black
Depth 13.2mm
Tensile Strength120 lbs (54.43 kg)
Wire/Cable Tie Type Standard, Locking
Bundle Diameter2.00 (50.80mm)
Height 8.128mm
Length 221mm
Width 0.275 7.00mm
Length - Approximate 8.75
Length - Actual 0.725' 220.98mm 8.70
RoHS StatusROHS3 Compliant
In-Stock:7000 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.942340$0.94234
10$0.889000$8.89
100$0.838679$83.8679
500$0.791207$395.6035
1000$0.746422$746.422

About BT2LH-L0

The BT2LH-L0 from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features BT2LH-L0 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BT2LH-L0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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