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PLC2S-S6-C0

PLC2S-S6-C0

PLC2S-S6-C0

Panduit Corp

PLC2S-S6-C0 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website

SOT-23

PLC2S-S6-C0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Screw
Mounting Type Screw Mount, Mounting Hole
Package / Case 201
Material Polyamide (PA66), Nylon 6/6
Weight 195.044719g
Body Material Nylon
Packaging100 per Pkg
Series PAN-TY® PLC
Published 2005
Feature Weather Resistant
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Max Operating Temperature85°C
Min Operating Temperature -40°C
Color Black
Depth 9.5mm
Wire/Cable Diameter 47 mm
Tensile Strength50 lbs (22.68 kg)
Wire/Cable Color Black
Wire/Cable Tie Type Standard, Locking
Bundle Diameter1.84 (46.74mm)
Height 4.1mm
Length 201mm
Width 0.190 4.83mm
Length - Approximate 8
Length - Actual 0.658' 200.66mm 7.90
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
In-Stock:18293 items

Pricing & Ordering

QuantityUnit PriceExt. Price
100$0.37670$37.67

About PLC2S-S6-C0

The PLC2S-S6-C0 from Panduit Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features PLC2S-S6-C0 datasheet pdf and Cable Ties and Cable Lacing product details from Panduit Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PLC2S-S6-C0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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