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HGT1S12N60A4DS

HGT1S12N60A4DS

HGT1S12N60A4DS

ON Semiconductor

HGT1S12N60A4DS datasheet pdf and Transistors - IGBTs - Single product details from ON Semiconductor stock available on our website

SOT-23

HGT1S12N60A4DS Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE, NOT REC (Last Updated: 1 day ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Number of Pins 3
Weight 1.31247g
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTube
JESD-609 Code e3
Pbfree Code yes
Part StatusNot For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Tin (Sn)
Additional FeatureLOW CONDUCTION LOSS
HTS Code8541.29.00.95
Max Power Dissipation167W
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 30
Base Part Number HGT1S12N60
JESD-30 Code R-PSSO-G2
Number of Elements 1
Element ConfigurationSingle
Power Dissipation167W
Case Connection COLLECTOR
Input Type Standard
Turn On Delay Time17 μs
Transistor Application POWER CONTROL
Polarity/Channel Type N-CHANNEL
Turn-Off Delay Time 96 μs
Collector Emitter Voltage (VCEO) 600V
Max Collector Current 54A
Reverse Recovery Time 30ns
Collector Emitter Breakdown Voltage600V
Collector Emitter Saturation Voltage2.7V
Turn On Time33 ns
Test Condition 390V, 12A, 10 Ω, 15V
Vce(on) (Max) @ Vge, Ic 2.7V @ 15V, 12A
Turn Off Time-Nom (toff) 180 ns
Gate Charge78nC
Current - Collector Pulsed (Icm) 96A
Td (on/off) @ 25°C 17ns/96ns
Switching Energy 55μJ (on), 50μJ (off)
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:1824 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.388138$2.388138
10$2.252960$22.5296
100$2.125434$212.5434
500$2.005126$1002.563
1000$1.891629$1891.629

HGT1S12N60A4DS Product Details

HGT1S12N60A4DS Description

The HGTG12N60A4D, HGTP12N60A4D andHGT1S12N60A4DS are MOS gated high voltage switching devices combining the best features of MOSFETs and bipolar transistors. These devices have the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The much lower on-state voltage drop varies only moderately between 25oC and 150oC. TheIGBT used is the development type TA49335. The diode used in anti-parallel is the development type TA49371. This IGBT is ideal for many high voltage switching applications operating at high frequencies where lowconduction losses are essential. This device has been optimized for high-frequency switch mode power s



HGT1S12N60A4DS Features

>100kHz Operation 390V, 12A

200kHz Operation 390V, 9A

600V Switching SOA Capability

Typical Fall Tim 70nsatTJ= 1259C

Low Conduction L oss

Temperature Compensating SABERTH Model


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