FDZ1323NZ Description
This particular device is intended to serve as a single package solution for ultra-portable applications such as Li-Ion battery pack protection circuits. The FDZ1323NZ reduces both PCB space and rs1S2(on)-resistance by utilizing two common drain N-channel MOSFETs, which enable bidirectional current flow, on Fairchild's innovative PowerTrench? process with cutting-edge "low pitch" WLCSP packaging method. This cutting-edge WLCSP MOSFET represents a development in packaging technique that makes it possible for the device to combine superior heat transfer properties, ultra-low profile packing, low gate charge, and low rSis2(on). -
FDZ1323NZ Features
only takes about 3 mm2 of PCB space.
When mounted to a PCB, an ultra-thin package has a height of less than 0.35 mm.
Ability to handle high power and current
3.6 kV or above for HBM ESD protection (Note 3)
REACH Compliant
FDZ1323NZ Applications
Battery administration
Charge switch
Battery security
