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FDP12N50NZ

FDP12N50NZ

FDP12N50NZ

ON Semiconductor

FDP12N50NZ datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

FDP12N50NZ Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Contact PlatingTin
Mount Through Hole
Mounting Type Through Hole
Package / Case TO-220-3
Number of Pins 3
Weight 1.8g
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTube
Published 2013
Series UniFET-II™
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
ECCN Code EAR99
Subcategory FET General Purpose Power
Technology MOSFET (Metal Oxide)
Number of Elements 1
Power Dissipation-Max 170W Tc
Element ConfigurationSingle
Operating ModeENHANCEMENT MODE
Power Dissipation170W
Turn On Delay Time20 ns
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 520m Ω @ 5.75A, 10V
Vgs(th) (Max) @ Id 5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 1235pF @ 25V
Current - Continuous Drain (Id) @ 25°C 11.5A Tc
Gate Charge (Qg) (Max) @ Vgs 30nC @ 10V
Rise Time50ns
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±25V
Fall Time (Typ) 45 ns
Turn-Off Delay Time 60 ns
Continuous Drain Current (ID) 11.5A
JEDEC-95 Code TO-220AB
Gate to Source Voltage (Vgs) 25V
Drain-source On Resistance-Max 0.52Ohm
Drain to Source Breakdown Voltage 500V
Pulsed Drain Current-Max (IDM) 46A
Avalanche Energy Rating (Eas) 560 mJ
Height 16.07mm
Length 10.36mm
Width 4.9mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:3851 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.76000$1.76
10$1.59000$15.9

FDP12N50NZ Product Details

FDP12N50NZ Description


UniFETMII MOSFET is a series of high voltage MOSFET products of Fairchild, which is based on advanced planar stripe and DMOS technology. This advanced MOSFET series has the lowest on-resistance in planar MOSFET, as well as superior switching performance and higher avalanche energy intensity. Besides. Internal gate source ESD diodes allow UniFET II MOSFET to withstand surging pressures exceeding 2KV HBM. The device family is suitable for switching power supply inverter applications such as power factor correction (PFC), flat panel display (FPD), TV power supply ATX and electronic lamp ballast.


FDP12N50NZ Features


·RDS(on)=460mΩ(Typ.)@VGs=10Vlp=5.75A

·Low Gate Charge(Typ.23nC)·Low Crss(Typ.14pF)

100% Avalanche Tested·ESD Improved Capability

·RoHS Compliant

FDP12N50NZ Applications


·LCD/LED/PDPTV Lighting

Uninterruptible Power Supply

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