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FDG313N

FDG313N

FDG313N

ON Semiconductor

FDG313N datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

FDG313N Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status LAST SHIPMENTS (Last Updated: 2 days ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-TSSOP, SC-88, SOT-363
Number of Pins 6
Weight 28mg
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2000
JESD-609 Code e3
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Resistance 450mOhm
Terminal Finish Tin (Sn)
Subcategory FET General Purpose Power
Voltage - Rated DC 25V
Technology MOSFET (Metal Oxide)
Terminal Position DUAL
Terminal FormGULL WING
Current Rating950mA
Number of Elements 1
Power Dissipation-Max 750mW Ta
Element ConfigurationSingle
Operating ModeENHANCEMENT MODE
Power Dissipation750mW
Turn On Delay Time3 ns
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 450m Ω @ 500mA, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 50pF @ 10V
Current - Continuous Drain (Id) @ 25°C 950mA Ta
Gate Charge (Qg) (Max) @ Vgs 2.3nC @ 4.5V
Rise Time8.5ns
Drive Voltage (Max Rds On,Min Rds On) 2.7V 4.5V
Vgs (Max) ±8V
Fall Time (Typ) 8.5 ns
Turn-Off Delay Time 17 ns
Continuous Drain Current (ID) 950mA
Threshold Voltage 800mV
Gate to Source Voltage (Vgs) 8V
Drain Current-Max (Abs) (ID) 0.95A
Drain to Source Breakdown Voltage 25V
Height 1mm
Length 2mm
Width 1.25mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:1083 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.139084$0.139084
10$0.131211$1.31211
100$0.123784$12.3784
500$0.116778$58.389
1000$0.110168$110.168

FDG313N Product Details

FDG313N Description


FDG313N is a type of N-Channel enhancement-mode field-effect transistor provided by ON Semiconductor based on its proprietary, high cell density, DMOS technology. It shows excellent performance in lowering on-state resistance on the basis of this technology. It acts as a replacement for bipolar digital transistor and small-signal MOSFET in low voltage applications.



FDG313N Features


  • Low on-state resistance

  • Low gate charge

  • Low RDS (on)

  • Available in the SC70-6 package

  • Proprietary, high cell density, DMOS technology



FDG313N Applications


  • Load switch

  • Battery protection

  • Power management


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