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BUK7210-55B/C1,118

BUK7210-55B/C1,118

BUK7210-55B/C1,118

NXP USA Inc.

MOSFET N-CH 55V DPAK

SOT-23

BUK7210-55B/C1,118 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case TO-252-3, DPak (2 Leads + Tab), SC-63
Operating Temperature-55°C~185°C TJ
PackagingTape & Reel (TR)
Published 2012
Series TrenchMOS™
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Technology MOSFET (Metal Oxide)
Power Dissipation-Max 167W Tc
FET Type N-Channel
Rds On (Max) @ Id, Vgs 10m Ω @ 25A, 10V
Vgs(th) (Max) @ Id 4V @ 1mA
Input Capacitance (Ciss) (Max) @ Vds 2453pF @ 25V
Current - Continuous Drain (Id) @ 25°C 75A Tc
Gate Charge (Qg) (Max) @ Vgs 35nC @ 10V
Drain to Source Voltage (Vdss) 55V
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±20V
RoHS StatusNon-RoHS Compliant
In-Stock:3531 items

About BUK7210-55B/C1,118

The BUK7210-55B/C1,118 from NXP USA Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features MOSFET N-CH 55V DPAK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BUK7210-55B/C1,118, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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