DS3170N Overview
Board space can be saved by using the 100-LBGA, CSBGA package.To pack telecommunications equipment, the way of Tray is used.The mounting type of this telecom circuit is Surface Mount.When the voltage for 3.135V~3.465V is provided, improved efficiency can be achieved.A -40°C~85°C-temperature setting offers reliable performance.Mounted in Surface Mount-direction.3.3V is its supply voltage.Telecom interfaces contain 100 pins.By using the DS3170 part number, more related parts can be found.It adopts FRAMER as its telecom IC type.To give designers much flexibility, it uses 120mA as the supply current.Other Telecom ICs subcategories telecommunications device .Normal operation requires a supply current of 145mA.
DS3170N Features
Available in the 100-LBGA, CSBGA package
FRAMER as telecom IC type
Operating supply current of 120mA
DS3170N Applications
There are a lot of Maxim Integrated DS3170N Telecom applications.
- DECT (Digital European Cordless Telephone) Base Stations
- E1 Multiplexer
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- E1 Multiplexer
- PDH Multiplexers
- Switches
- Add/Drop multiplexers (ADMs)
- High speed data transmission line cards
- Central office (CO)
- Digital Cross Connect Systems
