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HT19LG-G

HT19LG-G

HT19LG-G

Microchip Technology

8 Terminations8 Pin HT19 Telecom device1 CircuitsMin 2.7V VMax 5.25V V

SOT-23

HT19LG-G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Weight 540.001716mg
Operating Temperature0°C~50°C
PackagingTape & Reel (TR)
Published 2014
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish MATTE TIN
Max Power Dissipation800mW
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.3V
[email protected] Reflow Temperature-Max (s) 40
Base Part Number HT19
Function Switch
Qualification StatusNot Qualified
Number of Circuits 1
Max Supply Voltage5.25V
Min Supply Voltage2.7V
Length 4.9mm
Width 3.9mm
RoHS StatusROHS3 Compliant
In-Stock:4111 items

Pricing & Ordering

QuantityUnit PriceExt. Price

HT19LG-G Product Details

HT19LG-G Overview


A 8-SOIC (0.154, 3.90mm Width) package saves space on a board.In order to pack telecommunications equipment, Tape & Reel (TR) is used.A Surface Mount mounting type is used.A 1-circuit composes this telecom IC .0°C~50°C is the operating temperature that can be set for reliable performance.Mounted in the direction of Surface Mount.There are 8 terminations can be found in telecom switching configuration.It requires a supply voltage of 2.3V.An interface with 8 pins is present on this telecom interface.Telecom switching's base part number of HT19 can be used to find more related parts.2.7V is the minimum voltage that should be supplied.A lower voltage than 5.25V should be supplied.

HT19LG-G Features


Available in the 8-SOIC (0.154, 3.90mm Width) package

HT19LG-G Applications


There are a lot of Microchip Technology HT19LG-G Telecom applications.

  • Switches
  • Interfaces to SONET STS-1 Networks
  • PBX interfaces
  • CSU/DSU Equipment
  • Integrated Multi-Service Access Platforms (IMAPs)
  • Digital Cross Connect Systems
  • Frame Relay Switches and Access Devices (FRADS)
  • ATM Switches
  • DSLAMs
  • DECT (Digital European Cordless Telephone) Base Stations

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