IRFL4105 Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide ultra-low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications. The SOT-223 is a surface-mount package that may be soldered using vapor phase, infrared, or wave soldering processes. Its one-of-a-kind package design enables for easy automatic pick-and-place, just like other SOT or SOIC packages, but with the extra benefit of better thermal performance thanks to an expanded heatsink tab. In a typical surface mount application, power dissipation of 1.0W is attainable.
IRFL4105 Features
IRFL4105 Applications
Power Management
Consumer Electronics
Portable Devices
Industrial
