IRFL014NPBF Description
International Rectifier's Fifth Generation HEXFET? MOSFETs use cutting-edge processing methods to produce extraordinarily low on-resistance per silicon area. This feature gives the designer a highly effective and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET? power MOSFETs are renowned for.
The SOT-223 package is made to be surface-mounted utilizing infrared, vapor phase, or wave soldering processes.
In addition to having the same simple automatic pick-and-place functionality as regular SOT or SOIC packages, this package's special design offers increased thermal performance thanks to a larger tab for heatsinking. One Watt of power can be lost in a typical surface mount application.
IRFL014NPBF Features
IRFL014NPBF Applications
Power Management
Consumer Electronics
Portable Devices
Industrial
