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IRF7450

IRF7450

IRF7450

Infineon Technologies

IRF7450 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

SOT-23

IRF7450 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface MountYES
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTube
Published 2001
Series HEXFET®
JESD-609 Code e0
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional FeatureAVALANCHE RATED
HTS Code8541.29.00.95
Technology MOSFET (Metal Oxide)
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 245
[email protected] Reflow Temperature-Max (s) 30
JESD-30 Code R-PDSO-G8
Qualification StatusNot Qualified
Number of Elements 1
Configuration SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max 2.5W Ta
Operating ModeENHANCEMENT MODE
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 170m Ω @ 1.5A, 10V
Vgs(th) (Max) @ Id 5.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 940pF @ 25V
Current - Continuous Drain (Id) @ 25°C 2.5A Ta
Gate Charge (Qg) (Max) @ Vgs 39nC @ 10V
Drain to Source Voltage (Vdss) 200V
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±30V
JEDEC-95 Code MS-012AA
Drain Current-Max (Abs) (ID) 2.5A
Drain-source On Resistance-Max 0.17Ohm
Pulsed Drain Current-Max (IDM) 20A
DS Breakdown Voltage-Min 200V
Avalanche Energy Rating (Eas) 230 mJ
RoHS StatusNon-RoHS Compliant
In-Stock:2514 items

IRF7450 Product Details

IRF7450 Description


The exceptionally low on-resistance per silicon area is made possible by the use of cutting-edge manufacturing processes in these P-Channel HEXFET? Power MOSFETs from International Rectifier. This advantage gives the designer access to a highly effective tool for use in load and battery management applications.

The SO-8 is excellent for a range of power applications because to modifications made to its leadframe, including improved thermal performance and multiple-die support. These upgrades allow for the usage of many devices while drastically reducing board space in an application. The package is made to work with wave, infrared, or vapor phase soldering processes.



IRF7450 Features


  • Ultra Low On-Resistance

  • P-Channel MOSFET

  • Surface Mount

  • Available in Tape & Reel



IRF7450 Applications


  • Power Management

  • Consumer Electronics

  • Portable Devices

  • Industrial


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