IRF7769L2TR1PBF Description
In order to achieve the lowest on-state resistance in a package with a footprint smaller than a D2PAK and only a 0.7 mm profile, the IRF7769L2TR/TR1PbF blends the most recent HEXFET? Power MOSFET Silicon technology with the most modern DirectFETTM packaging. When application note AN-1035 detailing the manufacturing processes and procedures is adhered to, the DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment, and vapor phase, infra-red, or convection soldering techniques. Dual-sided cooling is possible with the DirectFET package, which maximizes heat transmission in power systems. Applications requiring synchronous rectification and high frequency switching are best served by the IRF7769L2TR/TR1PbF. Low temperatures are made possible by the device's reduced overall losses and high level of thermal performance.
IRF7769L2TR1PBF Features
RoHS Compliant, Halogen Free
Lead-Free (Qualified up to 260??C Reflow)
Ideal for High Performance Isolated Converter
Primary Switch Socket
Optimized for Synchronous Rectification
Low Conduction Losses
High Cdv/dt Immunity
Low Profile (<0.7mm)
Dual Sided Cooling Compatible
Compatible with existing Surface Mount Techniques
Industrial Qualified
IRF7769L2TR1PBF Applications
Power Management
Consumer Electronics
Portable Devices
Industrial
