IRF6725MTRPBF Description
The IRF6725MPBF combines the latest HEXFET? Power MOSFET Silicon technology with innovative DirectFETTM packaging to deliver the lowest on-state resistance in a MICRO-8-sized device with a 0.7 mm profile. When application note AN-1035 addressing manufacturing methods and procedures is followed, the DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment, and vapor phase, infrared, or convection soldering techniques. The DirectFET package enables dual-sided cooling in power systems, resulting in an 80 percent increase in thermal resistance over the previous best.
IRF6725MTRPBF Features
?Halogen-free and RoHS compliant
?Has a low profile (about 0.7 mm)
?Compatible with dual-sided cooling
?Inductance of the package is really low.
?It's designed for switching at high frequencies.
?Perfect for DC-DC Converters in CPU Cores
?Optimized for Sync.FET as well as a few Control FET applications)
?Low Switching and Conduction Losses
IRF6725MTRPBF Applications
Switching applications
