BGSA131MN10E6327XTSA1 Overview
Due to the enhanced 10-XFQFN Exposed Pad package, this RF IC is excellent .The RF modulator is packaged in a Tape & Reel (TR) package.PCB or development board with Surface Mount-type connectors can accommodate this RF modulator.
BGSA131MN10E6327XTSA1 Features
10-XFQFN Exposed Pad package
Tape & Reel (TR)
BGSA131MN10E6327XTSA1 Applications
There are a lot of Infineon Technologies BGSA131MN10E6327XTSA1 RF Misc ICs and Modules applications.
- Automotive radar
- PA linearization
- Balanced modulation
- Test and Measurement
- Cellular base stations
- Point-to-point radios
- Radio links
- Automotive
- Fixed wireless access
- Synchronous detection
