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EPC2037

EPC2037

EPC2037

EPC

Gan Trans 100V 550MOHM Bumped Di

SOT-23

EPC2037 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die
Operating Temperature-40°C~150°C TJ
PackagingTape & Reel (TR)
Series eGaN®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Technology GaNFET (Gallium Nitride)
FET Type N-Channel
Rds On (Max) @ Id, Vgs 550mOhm @ 100mA, 5V
Vgs(th) (Max) @ Id 2.5V @ 80μA
Input Capacitance (Ciss) (Max) @ Vds 14pF @ 50V
Current - Continuous Drain (Id) @ 25°C 1.7A Ta
Gate Charge (Qg) (Max) @ Vgs 0.12nC @ 5V
Drain to Source Voltage (Vdss) 100V
Drive Voltage (Max Rds On,Min Rds On) 5V
Vgs (Max) +6V, -4V
RoHS StatusROHS3 Compliant
In-Stock:5849 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About EPC2037

The EPC2037 from EPC is a high-performance microcontroller designed for a wide range of embedded applications. This component features Gan Trans 100V 550MOHM Bumped Di.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPC2037, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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