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SBB830-QTY25

SBB830-QTY25

SBB830-QTY25

Chip Quik Inc.

830 PTS SOLDER-IN BREADBOARD (EX

SOT-23

SBB830-QTY25 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material FR4 Epoxy Glass
Series Proto-Advantage
Size / Dimension 6.60Lx2.30W 167.6mmx58.4mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Pitch 0.1 2.54mm Grid
Plating Plated Through Hole (PTH)
Hole Diameter 0.039 (1.00mm)
Proto Board Type Breadboard, General Purpose
Circuit Pattern 5 Hole Pad (Single Side)
Board Thickness 0.063 1.60mm
RoHS StatusROHS3 Compliant
In-Stock:116 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$82.79000$82.79

About SBB830-QTY25

The SBB830-QTY25 from Chip Quik Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features 830 PTS SOLDER-IN BREADBOARD (EX.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SBB830-QTY25, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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