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SBB0802P-1

SBB0802P-1

SBB0802P-1

Chip Quik Inc.

SOLDER-IN BREADBOARD 1X1" (8 ROW

SOT-23

SBB0802P-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material FR4 Epoxy Glass
Series Proto-Advantage
Size / Dimension 1.00Lx1.00W 25.4mmx25.4mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Pitch 0.1 2.54mm Grid
Plating Plated Through Hole (PTH)
Hole Diameter 0.039 (1.00mm)
Proto Board Type Breadboard, General Purpose
Circuit Pattern Pad Per Hole (Round)
Board Thickness 0.063 1.60mm
RoHS StatusROHS3 Compliant
In-Stock:3761 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.38000$2.38

About SBB0802P-1

The SBB0802P-1 from Chip Quik Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features SOLDER-IN BREADBOARD 1X1" (8 ROW.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SBB0802P-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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