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10M40DCF484I6G

10M40DCF484I6G

10M40DCF484I6G

Intel

FPGAs MAX? 10 Series 484-BGA 484

SOT-23

10M40DCF484I6G Datasheet

non-compliant

In-Stock: 3453 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series MAX® 10
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish TIN SILVER COPPER
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of I/O 360
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 40000
Total RAM Bits 1290240
Number of LABs/CLBs 2500
RoHS Status RoHS Compliant
10M40DCF484I6G Product Details

10M40DCF484I6G Overview


In the package 484-BGA, this product is provided. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 360 I/Os for better data transfer. A fundamental building block is made up of 40000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. In order for it to operate, the supply voltage must be 1.15V~1.25V . The FPGA belongs to the MAX? 10 series of FPGAs, and it is one type of FPGA. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The total number of terminations is 484. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1290240 bFpga chipss. 2500 LABs/CLBs are configured on this FPGA.

10M40DCF484I6G Features


360 I/Os
Up to 1290240 RAM bits

10M40DCF484I6G Applications


There are a lot of Intel 10M40DCF484I6G FPGAs applications.

  • ASIC prototyping
  • Ecosystem
  • Electronic Warfare
  • Data Mining
  • Consumer Electronics
  • Medical Applications
  • Medical imaging
  • Data Center
  • Image processing
  • Space Applications

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