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10AX066N3F40I2SGES

10AX066N3F40I2SGES

10AX066N3F40I2SGES

Intel

3.5mm mm FPGAs Arria 10 GX Series 1517-BBGA, FCBGA 1mm mm

SOT-23

10AX066N3F40I2SGES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1517-BBGA, FCBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria 10 GX
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code8542.39.00.01
Voltage - Supply 0.87V~0.93V
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 0.9V
Terminal Pitch1mm
JESD-30 Code S-PBGA-B1517
Number of I/O 588
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 660000
Total RAM Bits 49610752
Number of LABs/CLBs 250540
Height Seated (Max) 3.5mm
Length 40mm
Width 40mm
RoHS StatusRoHS Compliant
In-Stock:1235 items

Pricing & Ordering

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10AX066N3F40I2SGES Product Details

10AX066N3F40I2SGES Overview


In the package 1517-BBGA, FCBGA, this product is provided. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The I/Os are designed to facilitate a more coherent transfer of data. To form a fundamental building block, there are 660000 logic elements/cells. An electrical supply voltage of 0.9V powers it. The Surface Mount-slot connector on the FPGA module can be connected to the development board. A supply voltage of 0.87V~0.93V is needed in order for fpga chips to operate. FPGAs belonging to the Arria 10 GX series are a type of FPGA that belong to the Arria 10 GX series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. In order to save space, this FPGA model has been contained in Tray. The RAM bits that are offered by this fpga chips are 49610752. A total of 250540 LABs/CLBs are included in this FPGA.

10AX066N3F40I2SGES Features


588 I/Os
Up to 49610752 RAM bits

10AX066N3F40I2SGES Applications


There are a lot of Intel 10AX066N3F40I2SGES FPGAs applications.

  • Distributed Monetary Systems
  • Embedded Vision
  • Military Temperature
  • ADAS
  • Device controllers
  • Telecommunication
  • High Performance Computing
  • Radar and Sensors
  • Computer hardware emulation
  • Aerospace and Defense

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