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XL210-512-FB236-I20

XL210-512-FB236-I20

XL210-512-FB236-I20

XMOS

ROMless XCore 32-Bit 10-Core Microcontroller XL Series 236 Pin 236-LFBGA

SOT-23

XL210-512-FB236-I20 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 236-LFBGA
Number of Pins 236
Supplier Device Package 236-FBGA (10x10)
Operating Temperature-40°C~85°C TA
PackagingTray
Series XL
Published 2015
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Oscillator TypeExternal
Number of I/O 128
Speed 2000MIPS
RAM Size 512K x 8
Memory TypeROMless
Voltage - Supply (Vcc/Vdd) 0.95V~3.6V
Core Processor XCore
Program Memory TypeROMless
Core Size 32-Bit 10-Core
Core Architecture XCore
RoHS StatusROHS3 Compliant
In-Stock:427 items

Pricing & Ordering

QuantityUnit PriceExt. Price
168$10.93101$1836.40968

XL210-512-FB236-I20 Product Details

XL210-512-FB236-I20 Overview


Packaged in a 236-LFBGA format. A total of 128 I/Os are on the Microcontroller. Surface Mount is the mounting type of the Microcontroller that is attached to the panel. This Microcontroller is based on a core called 32-Bit 10-Core. The type of its program memory is ROMless. In this Microcontroller, temperature is controlled within the range -40°C~85°C TA. A XL series electrical component is used in this application. With a XCore Core Processor, Microcontroller is fast and efficient. Chips have 236 pins. The equipment has a ROMless memory that is built in. It is equipped with a XCore core architecture which is integrated into it.

XL210-512-FB236-I20 Features


236-LFBGA package
Mounting type of Surface Mount
Minimum temperature of -40°C


XL210-512-FB236-I20 Applications


There are a lot of XMOS
XL210-512-FB236-I20 Microcontroller applications.


  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances

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