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XCVU7P-1FLVA2104I

XCVU7P-1FLVA2104I

XCVU7P-1FLVA2104I

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA

SOT-23

XCVU7P-1FLVA2104I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Virtex® UltraScale+™
Part StatusActive
HTS Code8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 832
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1724100
Total RAM Bits 260812800
Number of LABs/CLBs 98520
RoHS StatusROHS3 Compliant
In-Stock:32 items

Pricing & Ordering

QuantityUnit PriceExt. Price

XCVU7P-1FLVA2104I Product Details

XCVU7P-1FLVA2104I Overview


In the 2104-BBGA, FCBGA package, you will find fpga chips. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. Fpga chips is programmed wFpga chipsh 832 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 1724100 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 0.825V~0.876V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA belonging to the Virtex? UltraScale+? seies. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. There are 260812800 RAM bits that are available with this device. The FPGA consists of 98520 LABs/CLBs.

XCVU7P-1FLVA2104I Features


832 I/Os
Up to 260812800 RAM bits

XCVU7P-1FLVA2104I Applications


There are a lot of Xilinx Inc. XCVU7P-1FLVA2104I FPGAs applications.

  • Filtering and communication encoding
  • Enterprise networking
  • Embedded Vision
  • Telecommunication
  • Medical Applications
  • Data center hardware accelerators
  • Digital signal processing
  • Medical ultrasounds
  • Image processing
  • Automotive advanced driver assistance systems (ADAS)

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