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XCVU27P-L2FIGD2104E

XCVU27P-L2FIGD2104E

XCVU27P-L2FIGD2104E

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA

SOT-23

XCVU27P-L2FIGD2104E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
Series Virtex® UltraScale+™
Part StatusActive
Voltage - Supply 0.698V~0.742V
Reach Compliance Code compliant
Number of I/O 676
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2835000
Total RAM Bits 74344038
Number of LABs/CLBs 162000
In-Stock:50 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$68772.99000$68772.99
500$68085.2601$34042630.05
1000$67397.5302$67397530.2
1500$66709.8003$100064700.45
2000$66022.0704$132044140.8
2500$65334.3405$163335851.25

XCVU27P-L2FIGD2104E Product Details

XCVU27P-L2FIGD2104E Overview


As part of the 2104-BBGA, FCBGA package, it is included. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. 676 I/Os are available for transferring data more efficiently. Logic blocks consist of 2835000 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 0.698V~0.742V, this device operates with ease. FPGAs belonging to the Virtex? UltraScale+? series are a type of FPGA that belong to the Virtex? UltraScale+? series of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~100°C TJ range. Fpga electronics is worth mentioning that this device provides 74344038 bfpga electronics s of RAM. An array of 162000 LABs/CLBs is built into the FPGA.

XCVU27P-L2FIGD2104E Features


676 I/Os
Up to 74344038 RAM bits

XCVU27P-L2FIGD2104E Applications


There are a lot of Xilinx Inc. XCVU27P-L2FIGD2104E FPGAs applications.

  • Enterprise networking
  • Embedded Vision
  • Automotive
  • Image processing
  • Aerospace and Defense
  • Filtering and communication encoding
  • Data center hardware accelerators
  • Medical imaging
  • ASIC prototyping
  • ADAS

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