XCVU11P-1FLGA2577E Overview
Fpga chips is supplied in the 2577-BBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 448 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 2835000 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 0.825V~0.876V and uses a battery to supply power. An FPGA belonging to the Virtex? UltraScale+? series is referred to as an FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. A device like this one offers 396150400 RAM bits, which is a considerable amount of memory. A total of 162000 LABs/CLBs make up this FPGA array.
XCVU11P-1FLGA2577E Features
448 I/Os
Up to 396150400 RAM bits
XCVU11P-1FLGA2577E Applications
There are a lot of Xilinx Inc. XCVU11P-1FLGA2577E FPGAs applications.
- Industrial Ethernet
- Automation
- Video & Image Processing
- Voice recognition
- Software-defined radio
- Ecosystem
- Distributed Monetary Systems
- Wired Communications
- Telecommunication
- Data Center
